Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 |
| Layer count | 2-layer |
| PCB size | 163.9mm x 104.9mm=2Types =2PCS, +/- 0.15mm |
| PCB thickness | 25mil |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion tin |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 | Layer count | 2-layer |
| PCB size | 163.9mm x 104.9mm=2Types =2PCS, +/- 0.15mm | PCB thickness | 25mil |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion tin |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Immersion Tin Finished PCB ，25mil PCB ，Double-Sided RF PCB | ||
RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.
Key Features:
Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: V-0
Benefits:
High DK for RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance
High thermal conductivity for enhanced thermal management
Strong adhesion to smooth coppers
Low X, Y, Z expansion
Excellent price/performance ratio
| RF-10 Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | V-0 | V-0 | ||
This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.
Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.
It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.
The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.
With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.
Applications:
Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components
| PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass |
| Designation: | RF-10 |
| Dielectric constant: | 10.2 |
| Dissipation Factor | 0.0025 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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