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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin
China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

  1. China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin
  2. China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin
  3. China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin
  4. China Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RO3203
Layer count 2-layer
PCB size 65.78mm x 37.48 mm=1PCS
PCB thickness 20 mil
Copper weight 1oz (1.4 mils) outer layers
Surface finish Immersion Tin
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Material RO3203 Layer count 2-layer
PCB size 65.78mm x 37.48 mm=1PCS PCB thickness 20 mil
Copper weight 1oz (1.4 mils) outer layers Surface finish Immersion Tin
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin CHINA
High Light Immersion Tin PCBRogers RO3203 PCB20mil Green Soldermask PCB

The Rogers RO3203 PCB represents the latest advancement in high-frequency circuit materials, specifically engineered for exceptional electrical performance and mechanical stability. Constructed from ceramic-filled laminates reinforced with woven fiberglass, the RO3203 builds upon the legacy of the RO3000 Series, distinguished by its improved mechanical stability. With a dielectric constant of 3.02 and a low dissipation factor of 0.0016, this material extends the operational frequency range beyond 40 GHz, making it an ideal choice for a variety of demanding applications.

 

Key Features
The Rogers RO3203 PCB is designed with several standout features that enhance its performance and usability:

 

High-Frequency Performance: The dielectric constant of 3.02 ± 0.04 at 10 GHz ensures reliable signal integrity.

 

Low Dissipation Factor: With a dissipation factor of 0.0016 at 10 GHz, it minimizes energy losses, supporting high-frequency applications.

 

Thermal Stability: The material can withstand temperatures above 500°C, making it suitable for a wide range of environments.

 

Thermal Conductivity: At 0.87 W/mK, it effectively manages heat dissipation, which is crucial for high-performance circuits.

 

Coefficient of Thermal Expansion: The low CTE (X: 13 ppm/°C, Y: 13 ppm/°C, Z: 58 ppm/°C) matched to copper ensures reliable performance in epoxy multi-layer board hybrid designs.

 

Lead-Free Process Compatibility: Compliant with environmental standards, including a 94V-0 flammability rating, making it suitable for modern manufacturing processes.

 

Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Benefits
The RO3203 PCB offers numerous advantages that make it ideal for high-frequency applications:

 

Improved Rigidity: The woven glass reinforcement enhances rigidity, facilitating easier handling during assembly and manufacturing.

 

Uniform Performance: It provides consistent electrical and mechanical performance, making it perfect for complex multi-layer structures.

 

Low Dielectric Loss: This feature supports high-frequency applications exceeding 20 GHz, ensuring optimal signal transmission.

 

Excellent Dimensional Stability: High production yields are achievable due to its stability, making it a reliable choice for large-scale manufacturing.

 

Cost-Effective: The RO3203 is competitively priced, making it an economical option for volume manufacturing.

 

Technical Specifications


The Rogers RO3203 PCB features a 2-layer rigid stackup, designed for optimal performance:

 

Copper Layer 1: 35 μm

RO3203 Substrate: 20 mil (0.508 mm)

Copper Layer 2: 35 μm

 

The finished board dimensions are 65.78 mm x 37.48 mm, with a total thickness of 0.6 mm. It supports minimum trace and space of 5/5 mils and has a minimum hole size of 0.4 mm. The finished copper weight on the outer layers is 1 oz (1.4 mils), and the surface finish is immersion tin. Each board undergoes 100% electrical testing prior to shipment to ensure quality and reliability.

 

The Rogers RO3203 PCB is suitable for a wide range of applications, including automotive collision avoidance systems, GPS antennas, wireless telecommunications systems, microstrip patch antennas, direct broadcast satellites, data links in cable systems, remote meter readers, and power backplanes. Its versatility and high performance make it an invaluable asset in various industries, including automotive and telecommunications.

 

For more information or to place an order, please contact our sales team or visit our website. Experience the reliability and efficiency of the Rogers RO3203 PCB in your next project.

 

 

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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