Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RT duroid 6006 |
| Layer count | 2-layer |
| PCB size | 161.42mm x 63.57 mm=4 Types=4PCS, +/- 0.15mm |
| PCB thickness | 10 mil |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RT duroid 6006 | Layer count | 2-layer |
| PCB size | 161.42mm x 63.57 mm=4 Types=4PCS, +/- 0.15mm | PCB thickness | 10 mil |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Immesion Gold RT duroid 6006 PCB ，10mil RT duroid 6006 PCB | ||
Introducing a newly shipped PCB based on RT/Duroid 6006 substrate. It is designed for high-performance electronic and microwave applications. Utilizing Rogers RT/Duroid 6006 laminates, this PCB offers exceptional dielectric properties, making it ideal for compact circuit designs without compromising on performance. Its robust construction and reliable features are tailored for applications operating at X-band or below.
Key Features
- Material Composition: Made from Rogers RT/Duroid 6006 ceramic-PTFE composites.
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C for superior circuit performance.
- Dissipation Factor: Low loss with a dissipation factor of 0.0027 at 10 GHz/23°C, ensuring efficiency.
- Thermal Stability: Thermal degradation temperature exceeding 500 °C (TGA).
- Moisture Resistance: Extremely low moisture absorption at 0.05%, enhancing reliability.
- Coefficient of Thermal Expansion (CTE): X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C for dimensional stability.
- Copper Foil: Clad with standard and reverse treated electrodeposited copper foil.
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 33 | Z | % | ||
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 47 34 117 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 2.7 | g/cm3 | ASTM D792 | ||
| Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits
- Circuit Size Reduction: High dielectric constant enables smaller circuit designs.
- Low Loss Performance: Optimized for X-band applications, minimizing signal loss.
- Repeatable Performance: Tight control of εr and thickness ensures consistency across productions.
- Reliability: Features reliable plated through-holes for multi-layer board designs.
PCB Specifications
Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/Duroid 6006: 0.254 mm (10 mil)
Copper Layer 2: 35 μm
The board dimensions measure 161.42 mm x 63.57 mm (± 0.15 mm), with a minimum trace/space of 4/6 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.4 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers, ensuring durability and robustness in performance.
Quality Assurance
Each RT/Duroid 6006 PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets the highest quality standards. This commitment to quality gives customers peace of mind, knowing that they are receiving a product that has been thoroughly vetted for performance.
Applications
The RT/Duroid 6006 PCB is versatile and can be used in various applications, including:
Patch Antennas: Ideal for compact antenna designs that require high performance.
Satellite Communication Systems: Perfect for the demanding environment of satellite technology.
Power Amplifiers: Supports high-frequency applications without significant signal loss.
Aircraft Collision Avoidance Systems: Provides the reliability needed in critical aerospace applications.
Ground Radar Warning Systems: Essential for systems that require high reliability and performance.
| PCB Material: | Ceramic-PTFE Composites |
| Designation: | RT/duroid 6006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.0027 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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