1.6mm TU768 PCB Double Sided 1OZ Hot Air Soldering Level HASL

Product Specification

Introduction to TU-768

The TU-768 and its variant, TU-768P, are manufactured using high-quality woven E-glass combined with an advanced epoxy resin system. This unique composition not only grants UV-blocking properties but also ensures compatibility with automated optical inspection (AOI) processes. The TU-768 is specifically designed for applications that endure severe thermal cycles or extensive assembly work, making it a versatile and reliable choice for engineers and manufacturers alike.

Key Characteristics of the TU-768 PCB

Thermal Stability and Resistance

One of the standout features of the TU-768 is its high glass transition temperature (Tg) of 180°C. This characteristic is crucial for applications that require the PCB to withstand high temperatures without compromising performance. The laminate's excellent coefficient of thermal expansion (CTE), with values of 11-15 ppm/°C in both X and Y axes, ensures dimensional stability, minimizing the risk of warping or delamination during thermal cycling.

Compatibility and Reliability

The TU-768 is fully compatible with lead-free processes, aligning with current manufacturing trends and environmental regulations. Its superior chemical resistance and anti-conductive anodic filament (CAF) properties further enhance its reliability, making it suitable for high-density applications where performance and longevity are critical.

Low Loss Characteristics

With a dielectric constant (Dk) of 4.3 at both 5 GHz and 10 GHz, and a loss tangent (Df) as low as 0.018 at 1 GHz, the TU-768 PCB demonstrates excellent signal integrity. This low-loss performance is essential for high-frequency applications, where signal degradation can significantly impact overall system performance.

Construction and Specifications

This PCB features a 2-layer rigid stack-up that has been meticulously crafted to deliver optimal performance. Key construction details include:

- Layer Composition:
- Copper Layer 1: 35 μm
- TU-768 Core: 1.5 mm (60 mil)
- Copper Layer 2: 35 μm

- Board Dimensions: 110mm x 197mm with a tolerance of +/- 0.15mm, ensuring precision in manufacturing.
- Finished Thickness: 1.6mm, providing the necessary robustness for various applications.
- Surface Finish: Hot Air Soldering Level (HASL), ensuring excellent solderability and reliability.

Quality Assurance

This PCB adheres to IPC-Class 2 quality standards, ensuring that every unit meets rigorous benchmarks for performance and reliability. Each PCB undergoes a 100% electrical test prior to shipment, guaranteeing functionality and quality.

Typical Applications

The TU-768 PCB is designed for a diverse range of applications, making it a flexible choice for engineers:

- Consumer Electronics: Ideal for devices requiring reliable performance in compact form factors, such as smartphones and tablets.
 

- Servers and Workstations: Perfect for high-performance computing applications that demand stability and efficiency.
 

- Automotive: Engineered to withstand the demanding conditions of the automotive environment, including temperature variations and vibrations.

Conclusion

The TU-768 PCB represents a significant advancement in laminate technology, offering exceptional thermal stability, chemical resistance, and low-loss characteristics. Its robust design and compliance with modern manufacturing processes make it a reliable choice for engineers and manufacturers in various sectors. As we continue to innovate and push the boundaries of technology, the TU-768 stands out as a testament to quality and performance in PCB design.

For more information or to discuss how the TU-768 PCB can meet your specific needs, please contact our sales team at sales10@bichengpcb.com. Thank you advance!