Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Material | RT/duroid 5880 - 0.381 mm (15mil) |
Layer count | 2-layer |
PCB size | 65.9mm x 26.32 mm=1PCS, +/- 0.15mm |
PCB thickness | 0.5 mm |
Copper weight | 1oz (1.4 mils) outer layers |
Surface finish | ENEPIG |
Brand Name | Bicheng |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Material | RT/duroid 5880 - 0.381 mm (15mil) | Layer count | 2-layer |
PCB size | 65.9mm x 26.32 mm=1PCS, +/- 0.15mm | PCB thickness | 0.5 mm |
Copper weight | 1oz (1.4 mils) outer layers | Surface finish | ENEPIG |
Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA | ||
High Light | 15mil RT duroid 5880 PCB ,15mil RT duroid 5880 PCB Board ,PCB 2 Layer ENEPIG Circuit Board |
Introducing the RT/Duroid 5880 PCB
The RT/Duroid 5880 is a premium high-frequency laminate designed for demanding stripline and microstrip circuit applications. Crafted from advanced PTFE composites reinforced with glass microfibers, this PCB guarantees exceptional dielectric constant uniformity, ensuring reliable performance across a wide frequency range.
Key Features:
Dielectric Constant: 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C.
Dissipation Factor: An impressive 0.0009 at 10 GHz, minimizing signal loss.
Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C for stable performance under varying temperatures.
Low Moisture Absorption: Just 0.02%, making it ideal for high moisture environments.
Coefficient of Thermal Expansion (CTE): 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring isotropic behavior.
Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
1070(156) | 450(65) | X | ||||
860(125) | 380(55) | Y | ||||
Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
27(3.9) | 18(2.6) | Y | ||||
Ultimate Strain | 6 | 7.2 | X | % | ||
4.9 | 5.8 | Y | ||||
Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
710(103) | 500(73) | Y | ||||
940(136) | 670(97) | Z | ||||
Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
29(5.3) | 21(3.1) | Y | ||||
52(7.5) | 43(6.3) | Z | ||||
Ultimate Strain | 8.5 | 8.4 | X | % | ||
7.7 | 7.8 | Y | ||||
12.5 | 17.6 | Z | ||||
Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
Benefits:
Uniform Electrical Properties: Maintains consistent performance over a broad frequency spectrum.
Ease of Machining: Easily cut, sheared, and shaped to meet specific design requirements.
Chemical Resistance: Resistant to solvents and reagents commonly used in PCB etching and plating processes.
Established Material: Proven track record in various high-performance applications.
Lowest Electrical Loss: Optimized for minimal signal degradation, particularly in reinforced PTFE materials.
Construction and Specifications
This PCB is designed with a robust 2-layer rigid construction:
Layer Composition:
Copper Layer 1: 35 μm
RT/Duroid 5880 Core: 0.381 mm (15 mil)
Copper Layer 2: 35 μm
Dimensions: Each board measures 65.9 mm x 26.32 mm, with a tolerance of +/- 0.15 mm, enabling precise integration into various electronic devices.
Trace/Space: 5/6 mils
Hole Size: 0.2 mm
Finished Thickness: 0.5 mm
Surface Treatments: The PCB features an ENEPIG surface finish, offering excellent solderability and corrosion resistance.
Rigorous Testing Standards
Quality assurance is paramount in electronic manufacturing. The RT/Duroid 5880 PCB undergoes a thorough 100% electrical test prior to shipment, ensuring that every unit meets stringent performance criteria. It adheres to IPC-Class-2 standards, making it reliable for commercial applications.
Applications in the Industry
The RT/Duroid 5880 PCB is versatile, catering to a multitude of high-frequency applications, including:
Commercial Airline Broadband Antennas: Enhancing communication systems for in-flight connectivity.
Microstrip and Stripline Circuits: Providing reliable performance in various RF applications.
Millimeter Wave Applications: Supporting next-generation wireless technologies.
Radar Systems: Offering precision and reliability in critical defense and commercial radar applications.
Guidance Systems: Ensuring accurate navigation and targeting in aerospace and military applications.
Point-to-Point Digital Radio Antennas: Facilitating high-speed data transmission over long distances.
Conclusion
The RT/Duroid 5880 PCB is a formidable solution for engineers and manufacturers seeking high-performance, reliable, and versatile printed circuit boards. With its advanced material properties, ease of fabrication, and proven track record in critical applications, this PCB is poised to become a cornerstone in the development of next-generation electronic systems. As industries continue to advance towards higher frequencies and greater efficiency, the RT/Duroid 5880 stands ready to meet and exceed those challenges, ensuring optimal performance in a rapidly changing technological landscape.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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