Product Specification

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics

Overview of Three station diamond single line cutting machine 

This high-performance Three-Station Diamond Single Wire Cutting Machine is designed specifically for square cutting of hard and brittle materials. Featuring three independent workstations, it enables simultaneous cutting of three raw material blocks, greatly enhancing productivity and flexibility. The machine is suitable for large-size square substrates of materials such as silicon carbide, sapphire, ceramics, precious metals, quartz, and semiconductors.

Key Features of Three station diamond single line cutting machine

 High-Efficiency & Precision Cutting

• Adopts a stationary material + downward swinging diamond wire cutting method.
• Fully controlled by a servo motor system, with advanced tension feedback.
• Cutting speed of diamond wire can reach up to 1000 m/min.
• Cutting thickness range: 0 mm – 600 mm, adaptable for various production needs.
• Achieves surface cutting accuracy of 0.01 mm, ensuring high flatness and uniformity.

 Multi-Station Design for Batch Processing

• Three simultaneous workstations for batch cutting and processing.
• Greatly improves throughput for high-volume manufacturing lines.

Wide Material Compatibility

• Suitable for hard and brittle materials such as:
  • Silicon carbide (SiC)
  • Sapphire
  • Ceramics
  • Precious metals
  • Quartz
  • Semiconductor materials
• Supports both standard square cutting and non-standard customization.

Stable Operation & Low Maintenance

• All key motion modules—unwinding, rewinding, wire guiding, spindle, tension control, and worktable feeding—are driven by servo motors.
• Closed-loop feedback for tension control ensures constant tension and avoids wire breakage.
• Equipped with tension warning system for real-time monitoring.
• Designed for long-term, high-load operation with minimal downtime and maintenance.

High-End Control System

• Advanced full-servo motor control combined with intelligent algorithms.
• Automatically adjusts cutting force and speed based on material hardness.
• Maintains stable cutting even for difficult materials like hard SiC and fragile ceramics.
• Cutting speed adjustable between 0.01 mm/min – 10 mm/min to ensure high-precision slicing for small and medium components.

Operation Procedure of Three station diamond single line cutting machine

1. Replace the wire wheel and prepare for wire winding.

2. Place and secure raw materials on the workbench.

3. Close the protective cover and configure parameters via the control panel.

4. Open the water valve and press the start button.

5. The diamond wire sways and descends, continuously cutting through the material.

6. After cutting, close the water valve and unload finished products.

Construction & Components

• Core components are precision-cast and the main transmission units are imported to ensure system stability and accuracy.

• Equipped with UPS from Tianjin Shengong series, providing uninterrupted power support for critical operations.

Technical Highlights  of Three station diamond single line cutting machine

Why Choose Three station diamond single line cutting machine

•  High-speed cutting
•  Exceptional precision
•  Flexible multi-material compatibility
•  Sturdy, low-maintenance design
•  Perfect for semiconductor and hard substrate industries

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