Guangdong Taijin Semiconductor Technology Co., Ltd
| Delivery Time | 40 days |
| Packaging Details | Wooden Packing |
| Capacity | 1000 units/hour |
| Control System | PLC |
| Cooling System | Water cooling |
| Dimensions | 2000mm x 1500mm x 1800mm |
| Heating Power | 10 kW |
| Injection Pressure | 200 MPa |
| Injection Speed | 200 mm/s |
| Injection Volume | 1000 cc |
| Material Compatibility | Silicone, Epoxy, Polyurethane |
| Model | SM-1000 |
| Mold Clamping Force | 100 tons |
| Operating Temperature | 150-200℃ |
| Power Supply | 220V/50Hz |
| Brand Name | TJIN |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Delivery Time | 40 days | Packaging Details | Wooden Packing |
| Capacity | 1000 units/hour | Control System | PLC |
| Cooling System | Water cooling | Dimensions | 2000mm x 1500mm x 1800mm |
| Heating Power | 10 kW | Injection Pressure | 200 MPa |
| Injection Speed | 200 mm/s | Injection Volume | 1000 cc |
| Material Compatibility | Silicone, Epoxy, Polyurethane | Model | SM-1000 |
| Mold Clamping Force | 100 tons | Operating Temperature | 150-200℃ |
| Power Supply | 220V/50Hz | Brand Name | TJIN |
| Certification | ISO9001 | Place of Origin | China |
| High Light | Semiconductor Molding Press Machine ，Molding Press semiconductor equipment | ||
Automatic Molding Press Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
Technical Parameters:
| Type | Vertical Injection Molding Machine |
| Control System | PLC |
| Model | SM-1000 |
| Cooling System | Water |
| Weight | 5 Tons |
| Clamping Force | 1000KN |
| Capacity | 100 Tons |
| Screw Diameter | 35 Mm |
| Max. Mold Height | 400Mm |
| Injection Pressure | 200 Mpa |
| Auto Transfer Molding | Yes |
| Auto Packaging Equipment | Yes |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
3 milliom
Total Annual:
5 million-10 million
Employee Number:
500~800
Ecer Certification：
Active Member
Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi... Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . As a professional semiconductor semi...
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