DMS-HB1-Z09 Hokuyo Lidar Sensor IP69K Shock Resistant For Extreme Environments

Product Specification

High-Precision Optical Data Transmission Module for Industrial Automation

The HOKUYO DMS-HB1-Z09 is a compact, high-reliability optical transceiver engineered for seamless wireless data exchange in dynamic industrial environments. Designed with a 1-meter transmission range and ±20° directional alignment , this module ensures robust connectivity for automated guided vehicles (AGVs), overhead hoist transfer (OHT) systems, and semiconductor material handling applications. Leveraging infrared LED technology (850 nm wavelength) and pulsed amplitude modulation (PAM), it achieves 40 ms cycle time with 8-bit parallel data transfer, supporting real-time control signals like GO/STOP/ACK for precision material handoff operations. The 25-pin D-sub connector and 2-meter shielded cable enable quick integration with PLCs and AMHS systems, while the IP64-rated aluminum housing safeguards against dust, water splashes, and vibrations (500 m/s² per IEC 60068-2-27).

Certified for SEMI E84 compliance , the DMS-HB1-Z09 streamlines semiconductor manufacturing workflows by enabling standardized 8-bit optical handshakes between process equipment and AGVs. Unlike Sick’s ODSU-2000, which relies on analog outputs, the DMS-HB1-Z09’s digital parallel interface ensures error-free data integrity in high-noise environments. Its dual operating modes—active (transmit-and-wait) and passive (constant listening)—allow flexible master-slave configurations, outperforming Keyence’s GLV series, which lacks passive monitoring capability. With DC 10–30V power supply and ≤100 mA power consumption, it delivers energy-efficient performance for long-term deployments.

Rugged Design for Harsh Industrial Environments

Built to withstand extreme operational demands, the DMS-HB1-Z09 features a polycarbonate optical window and -10°C to +50°C temperature tolerance , ensuring stable performance in cleanrooms (ISO 14644-1 Class 5) and dusty factory floors. Its ambient illuminance tolerance up to 4,000 lux surpasses Omron’s E3Z series, making it ideal for brightly lit assembly lines. The encoder input function dynamically adjusts transmission parameters based on AGV speed, optimizing safety during high-velocity maneuvers—a feature absent in most competitor models.

The module’s semi-E84 protocol compatibility simplifies integration with semiconductor automated material handling systems (AMHS), while the RS-485 interface supports multi-device synchronization for complex layouts. With CE certification and RoHS compliance, it meets global safety standards for EU and North American markets. The replaceable optical window (UAM-W002) and shielded cabling minimize downtime from contamination or electromagnetic interference, ensuring uninterrupted operation in mission-critical applications like automotive assembly and pharmaceutical logistics.

Versatile Integration for Smart Factory Optimization

The DMS-HB1-Z09 redefines flexibility with plug-and-play installation and onboard potentiometer configuration, reducing setup time by 30% compared to traditional wired solutions. Its parity check error detection and multi-echo filtering enhance data reliability, critical for semiconductor wafer handling and vertical lift module (VLM) automation. For cleanroom environments, the module’s low outgassing properties ensure compliance with ISO 14644-1 Class 5 standards, a key advantage over competitors like Sick’s ODSU-2000, which lacks specialized cleanroom certifications.

By supporting ROS (Robot Operating System) via the urg_node package, it enables seamless integration with autonomous robotics platforms, empowering real-time navigation and obstacle detection. The optical window contamination warning function alerts users to maintenance needs, while the modular design allows field replacement of critical components without system downtime. With a 1-year warranty and global technical support network, HOKUYO ensures minimal operational disruptions, positioning the DMS-HB1-Z09 as a strategic asset for Industry 4.0 transformations. Whether used in high-speed logistics or precision semiconductor production, this module combines reliability, efficiency, and adaptability to meet the evolving demands of modern automation.

Packaging & Shipping

Company Information

Xiamen ZhiCheng Automation Technology Co., Ltdit is a leading global supplier of control system components. We specialize in control systems and drives.
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