Double Sided FR4 HASL Lead Free Surface IPC Class 2 Printed Circuit Boards

Product Specification

Double Sided FR4 HASL Lead Free Surface IPC Class 2 Printed Circuit Boards

Detail Specifications:

• Layers: 2
• Material: FR-4
• Board thickness:1oz
• Copper thickness:1.6mm
• Surface treatment: ENIG
• Min drill hole: 0.15mm
• Min line track/space:0.15mm
• Soldmask color: green
• Silkscreen color: white
• Quality standard: IPC class 2
• Certifications: ISO9001, UL, RoHS Directive-compliant

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Manufacturer Capacity:

    Printed circuit boards (PCBs) are the basic components of electronic equipment and are the physical foundation that connects and supports various electronic components. It plays a vital role in the functionality and reliability of electronic systems.

Key aspects of electronic printed circuit boards include:

Layers and composition:
    PCBs are typically made up of multiple layers, with the most common being a 2- or 4-layer design.
    These layers are made of copper serving as conductive paths and a non-conductive substrate such as fiberglass (FR-4) or other specialty materials.
    Other layers may include power and ground planes for power distribution and noise reduction.

Interconnects and Traces:
    The copper layer is etched to form conductive traces that serve as pathways for electrical signals and power.
    Vias are plated-through holes that connect traces between different layers, enabling multi-layer interconnections.
    Trace width, spacing, and routing patterns are designed to optimize signal integrity, impedance, and overall electrical performance.

Electronic component:
    Electronic components, such as integrated circuits, resistors, capacitors, and connectors, are mounted and soldered to the PCB.
    The placement and routing of these components is critical to ensuring optimal performance, cooling, and overall system functionality.

PCB manufacturing technology:
    PCB manufacturing processes typically involve steps such as lamination, drilling, copper plating, etching and solder mask application.
    Advanced technologies such as laser drilling, advanced plating, and multi-layer co-lamination are used in specialized PCB designs.

PCB Assembly & Soldering:
    Electronic components are placed and soldered onto the PCB either manually or automatically using techniques such as through-hole soldering or surface mount soldering.
    Reflow soldering and wave soldering are common automated processes for connecting components.

Testing & Quality Control:
    The PCB undergoes various testing and inspection processes such as visual inspection, electrical testing, and functional testing to ensure its reliability and performance.
    Quality control measures, such as in-process inspections and design-for-manufacturability (DFM) practices, help maintain high standards in PCB production.

    Electronic PCBs are used in a wide variety of applications, including consumer electronics, industrial equipment, automotive systems, medical devices, aerospace and telecommunications equipment, and more. Continuing advances in PCB technology, such as the development of high-density interconnect (HDI) PCBs and flexible PCBs, have enabled the creation of smaller, more powerful, and more energy-efficient electronic devices.

More photoes of double sided FR4 1.6mm 1oz HASL Lead Free PCB from experienced PCB manufacturer​