Shenzhen Hongxinteng Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | The production capacity is 30 units a month |
| Delivery Time | 20-25 |
| Packaging Details | Vacuum packing plus wooden box packing |
| Application | COB flexible Strip light |
| Name | Flip Chip Die Bonder |
| Maximum board size | 152MMX152MM |
| Condition | Original new |
| Usage | SMD LED SMT |
| core components | PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump |
| Brand | GKG |
| Brand Name | GKG |
| Model Number | GD602D |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The production capacity is 30 units a month |
| Delivery Time | 20-25 | Packaging Details | Vacuum packing plus wooden box packing |
| Application | COB flexible Strip light | Name | Flip Chip Die Bonder |
| Maximum board size | 152MMX152MM | Condition | Original new |
| Usage | SMD LED SMT | core components | PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump |
| Brand | GKG | Brand Name | GKG |
| Model Number | GD602D | Certification | CE |
| Place of Origin | China |
Product Features
1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding.
2. Compatible with a printer to enable a variety of in-line process solutions.
3. Fully integrated carrier from loading, printing, to die bonding and placement.
4. The carrier supports 0.5M materials, and mid-process transfers are accomplished using a docking station.
5. Equipped with a variety of practical features, including automatic calibration, automatic die ring changer, and a feeder-style quick-release workbench.
| Speed of die attach | ≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements) |
| Position accuracy of die attach | ± 1 mil (± 25um) |
| Angle accuracy of wafer | ± 1 ° |
| Crystal loss detection function | With (vacuum detection mode) |
| Solid leakage detection function | With (vacuum detection mode) |
| Capacity statistics function | Yes |
| Statistical function of consumables usage | Yes |
| Function of parameter modification record | Yes |
| User privilege management function | Yes |
| Module of wafer worktable | |
| Size of the chip | 3milx5mil-60mlx60mil |
| Thickness of the wafer | 0.1-0.7 mm |
| Maximum correction angle of wafer | ± 15 ° |
| Maximum size of wafer and wafer ring | 6“Crystal Ring (152 mm outer diameter) .” |
| Maximum area size of wafer | 4.7“(119 mm) |
| Maximum travel of worktable | 152MMX152MM |
| XY resolution | 0.5 um |
| Thimble height travel in z direction | 3 mm |
| Thimble cap | Single Needle (with) |
| Motor and drive system | Home-made linear motor & Huichuan District Drive |
| Image recognition system | |
| Methods of image recognition | 256 grayscale |
| Image resolution | 720 * 540 |
| Accuracy of image recognition | ± 0.025 Mil@50 Mil observed range |
| Foolproof function of chip | Yes |
| Pre-consolidation testing function | Yes |
| Post-consolidation image detection function | Yes |
| Mode of feeding | Automatic connection of incoming and outgoing materials |
| Solid Crystal Swing Arm System | |
| The way of fixing crystal | Double Swing Arm 180 ° rotation solidification |
| Suction pressure of crystal | 30g-250g adjustable |
| Manual adjustment of suction nozzle vacuum sensitivity | Yes |
| Module of substrate workbench | |
| Mounting speed | 5000-6000UPH |
| Range of travel of worktable | 140mmx620mm |
| Adapt to the width of the substrate | 60-120mm |
| Adapt to the length of the substrate | 100-600mm |
| Thickness of substrate | 0.1-2mm |
| XY resolution | 0.5um |
| Motor and drive system | Home-made Linear Motor & Huichuan District Drive |
| Fixing method of base plate | Manipulator plus vacuum suction platform |
Product application
COB flexible lamps are mainly used in smart home, intelligent lighting, car decoration, intelligent decoration and other applications.
Applicable products: Flexible Lamp Belt (FPC, PCB, BT) , SMD, resistors, IC components and other flip-chip products solid crystal.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
5000000-8000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ... Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, produ...
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