Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram |
| Thinkness range | 0.020"(0.5mm)~0.200" (5.0mm) |
| Sample | Sample Avaliable |
| Flam rating | 94 V0 |
| Hardness | 60 Shore 00 |
| Thermal Conductivity | 1.0W/mK |
| Color | Gray |
| Keywords | Silicone Thermal Pads |
| Brand Name | Ziitek |
| Model Number | TIF100-10-02F Series |
| Certification | RoHS and UL recognized |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram | Thinkness range | 0.020"(0.5mm)~0.200" (5.0mm) |
| Sample | Sample Avaliable | Flam rating | 94 V0 |
| Hardness | 60 Shore 00 | Thermal Conductivity | 1.0W/mK |
| Color | Gray | Keywords | Silicone Thermal Pads |
| Brand Name | Ziitek | Model Number | TIF100-10-02F Series |
| Certification | RoHS and UL recognized | Place of Origin | China |
| High Light | silicone thermal pad for CPU GPU ，electrical insulation thermal gap filler ，0.5 to 5.0mm thermal pad | ||
Electrical Insulation Silicone Pad Thermal Gap Filler Thickness 0.5 To 5.0mm Thermal Pad For Cpu Gpu Ram
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product description
TIF100-10-02F Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness
> Easy release construction
> Electrically isolating
> High durability
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
| Typical Properties of TIF100-10-02F Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ******* |
| Specific Gravity | 2.3g/cc | ASTM D297 |
| Thickness range | 0.020"(0.5mm)~0.200" (5.0mm) | ASTM C351 |
| Hardness (thickness ≥1.0mm) | 60 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temp | -40 ~160℃ | ******* |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | 1.0X1012Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 1.0W/mK | ASTM D5470 |
| Outgassing(TML) | 0.35% | ASTM E595 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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