Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Soft 3.0W Thermal Conductive Silicone Pad With Various Thermal Conductivity |
| Keywords | Thermal Conductive Silicone Pad |
| Hardness | 30 Shore 00 |
| Thermal Conductivity | 3.0W/mK |
| Color | Gray |
| Flam rating | 94 V-0 |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) |
| Application | CPU And GPU processors and other chipsets |
| Brand Name | Ziitek |
| Model Number | TIF100C 3030-11 |
| Certification | RoHS and UL recognized |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Soft 3.0W Thermal Conductive Silicone Pad With Various Thermal Conductivity | Keywords | Thermal Conductive Silicone Pad |
| Hardness | 30 Shore 00 | Thermal Conductivity | 3.0W/mK |
| Color | Gray | Flam rating | 94 V-0 |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) | Application | CPU And GPU processors and other chipsets |
| Brand Name | Ziitek | Model Number | TIF100C 3030-11 |
| Certification | RoHS and UL recognized | Place of Origin | China |
| High Light | 3.0W Thermal Conductive Silicone Pad ，Various Thermal Conductivity Silicone Pad ，Soft Thermal Conductive Silicone Pad | ||
Soft 3.0W Thermal Conductive Silicone Pad With Various Thermal Conductivity
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TS-TIF®100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 5.0W/mK
> Self-adhesive without the need for additional surface adhesive
> Highly compressible, soft, and elastic
> Available in various thicknesses
> Good chemical stability
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TS-TIF®100C 3030-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.1g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 30(Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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