Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Custom Silicone Gray 10.0W Ultra Soft Thermal Pad On Memory Modules |
| Application | Memory Modules |
| Thermal Conductivity | 10.0W/mK |
| Hardness | 75 Shore 00 |
| Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
| Color | Gray |
| Flam rating | 94 V-0 |
| Keywords | Thermal Pad |
| Features | Available in arious thicknesses |
| Brand Name | Ziitek |
| Model Number | TIF100C 10075-11 |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Custom Silicone Gray 10.0W Ultra Soft Thermal Pad On Memory Modules | Application | Memory Modules |
| Thermal Conductivity | 10.0W/mK | Hardness | 75 Shore 00 |
| Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) | Color | Gray |
| Flam rating | 94 V-0 | Keywords | Thermal Pad |
| Features | Available in arious thicknesses | Brand Name | Ziitek |
| Model Number | TIF100C 10075-11 | Certification | UL & RoHS |
| Place of Origin | China | ||
| High Light | Custom Silicone Thermal Pad ，10.0W Silicone Thermal Pad ，Ultra Soft Silicone Thermal Pad | ||
Custom Silicone Gray 10.0W Ultra Soft Thermal Pad On Memory Modules
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
The TS-TIF ®100C 10075-11 Series is a silicone-based thermal material designed to fill the gapsbetween heat-generating components and liquid cooling plates or metal bases. lts flexibility andelasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, itefficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metalheat dissipation structures, thereby improving the cooling efficiency of high-power electroniccomponents and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 10W/mK
> Self-adhesive without the need foradditional surface adhesive
> Highly compressible, soft, and elasticAvailable in various thicknesses
> Good chemical stability
Applications:
> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
| Typical Properties of TIF ®100C 10075-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.3g/cc | ASTM D792 |
| thickness | 0.020"(0.50mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 75 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 5.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL94(E331100) |
| Thermal conductivity | 10.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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