Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | High-Temperature Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad |
| Application | Laptop Heatsink LED CPU GPU MOS |
| Features | High-Temperature Resistant Flame-Retardant |
| Hardness | 45 Shore 00 |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) |
| Color | Gray |
| Flam rating | 94 V-0 |
| Thermal Conductivity | 7.5W/mK |
| Keywords | Silicone Thermal Pad |
| Brand Name | Ziitek |
| Model Number | TS-TIF100C 7545-11 |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | High-Temperature Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad | Application | Laptop Heatsink LED CPU GPU MOS |
| Features | High-Temperature Resistant Flame-Retardant | Hardness | 45 Shore 00 |
| Thinkness range | 0.012"(0.30mm)~0.200"(5.00mm) | Color | Gray |
| Flam rating | 94 V-0 | Thermal Conductivity | 7.5W/mK |
| Keywords | Silicone Thermal Pad | Brand Name | Ziitek |
| Model Number | TS-TIF100C 7545-11 | Certification | UL & RoHS |
| Place of Origin | China | ||
| High Light | 7.5W/MK Silicone Thermal Pad ，Flame Retardant Silicone Thermal Pad ，High Temperature Resistant Silicone Thermal Pad | ||
High-Temperature Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
The TS-TIF ®100C 7545-11 Series is a silicone-based thermal material designed to fill the gapsbetween heat-generating components and liquid cooling plates or metal bases. lts flexibility andelasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, itefficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metalheat dissipation structures, thereby improving the cooling efficiency of high-power electroniccomponents and extending the lifespan of the equipment.
Features:
> Excellent thermal conductivity 6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> UL recognized
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Power supply
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
| Typical Properties of TS-TIF ®100C 7545-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.4g/cc | ASTM D792 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 45 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.0MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL94(E331100) |
| Thermal conductivity | 7.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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