Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-6 work days |
| Packaging Details | 24*23*12cm |
| Name | High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions |
| Color | Gray |
| Keyword | Phase Change Materials |
| Feature | Low melting point |
| Thermal conductivity | 5W/mK |
| Applicatoin | Memory Modules |
| Density | 2.6 g/cc |
| Temperature range | -40℃～125℃ |
| Brand Name | Ziitek |
| Model Number | TIC805G |
| Certification | RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-6 work days | Packaging Details | 24*23*12cm |
| Name | High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions | Color | Gray |
| Keyword | Phase Change Materials | Feature | Low melting point |
| Thermal conductivity | 5W/mK | Applicatoin | Memory Modules |
| Density | 2.6 g/cc | Temperature range | -40℃～125℃ |
| Brand Name | Ziitek | Model Number | TIC805G |
| Certification | RoHS | Place of Origin | China |
| High Light | Phase Change Material PCM Cooling Pad ，High Performance PCM Cooling Pad ，Heat Pipe Thermal PCM Cooling Pad | ||
High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIC800G Series Datasheet-(E)-REV01.pdf
Features
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TICTM800G Series | |||||
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" | 0.008" | 0.010" | 0.012" | **** |
| (0.127mm) | (0.203mm) | (0.254mm) | (0.305mm) | ||
| Thickness Tolerance | ±0.0005'' | ±0.0008'' | ±0.0010'' | ±0.0012'' | **** |
| (±0.127mm) | (±0.203mm) | (±0.0254mm) | (±0.0305mm) | ||
| Density | 2.6g/cc | Helium Pycnometer | |||
| Temperature range | -40℃～125℃ | **** | |||
| Phase Change Softening Temperature | 50℃~60℃ | **** | |||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) | |||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W | ||
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800G series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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