Payment Terms | L/C,T/T,Western Union |
Delivery Time | 5-25days |
Purduct Name | Tungsten carbide nozzle |
Usage | Laser Welding Component |
Tolerance | ±0.005mm |
Trs | 1180-2250 N/mm3 |
Materials | Tungsten Carbide |
Packing | Standard export package |
Inner Hole | Customized |
Dimenstion | Customized |
Density | 14.9 g/cm3 |
Keywords | Cemented carbide nozzle |
Brand Name | Sanxin |
Model Number | SX1255 |
Certification | ISO 9001 |
Place of Origin | Zhuzhou |
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Product Specification
Payment Terms | L/C,T/T,Western Union | Delivery Time | 5-25days |
Purduct Name | Tungsten carbide nozzle | Usage | Laser Welding Component |
Tolerance | ±0.005mm | Trs | 1180-2250 N/mm3 |
Materials | Tungsten Carbide | Packing | Standard export package |
Inner Hole | Customized | Dimenstion | Customized |
Density | 14.9 g/cm3 | Keywords | Cemented carbide nozzle |
Brand Name | Sanxin | Model Number | SX1255 |
Certification | ISO 9001 | Place of Origin | Zhuzhou |
High Light | Tungsten Carbide Solder Ball Blasting Nozzle ,Micron-level Soldering Blasting Nozzle ,Laser Solder Ball Blasting Nozzle |
Micron-level soldering expert: Carbide laser solder ball nozzle
Introduction:
200-1500μm full range coverage —zero hole blocking·coaxiality ±0.002
It breaks through the bottlenecks of hole blocking and solder sticking of traditional nozzles, and realizes tens of millions of burr-free and splash-free precise solder ball injection in the field of microelectronics packaging.
Specification:
Solder ball size (μm) | Inner diameter (mm) | Tolerance standard | Applicable scenarios |
200-250 | Φ0.09-0.12 | ±0.001mm | IC wafer/acoustic device micro solder joint |
300-350 | Φ0.34±0.003 | ±0.003mm | Mobile phone camera/data cable solder joint |
450-600 | Φ0.55-0.65 | ±0.004mm | Automotive radar/FPC soft board |
750-900 | Φ0.85-0.95 | ±0.005mm | Power module/relay (main model) |
1000-1500 | Φ1.02-1.50 | ±0.008mm | High power PCB ground pad |
PS. : The size is for reference only, customization is supported
Application:
Consumer electronics
Mobile phone camera module: 0.15mm solder joint spacing CCM welding (350μm solder ball nozzle)
Type-C interface terminal: multi-level countersunk hole precision welding (aperture tolerance ±0.003mm)
TFT/FPC flexible screen: non-contact welding in temperature sensitive areas (avoid electrostatic damage)
High-end electronics and semiconductors
Reversing radar sensor: anti-vibration welding (600μm nozzle for 1.0mm pad)
IC wafer packaging: φ0.09μm micro-hole solder ball precise positioning (coaxiality ≤0.005)
Optical module fiber coupling: spatter-free welding (inert gas protection process)
Industrial core components
Automobile key chip: micro solder joint oxidation resistance (400μm nozzle)
Fuse ceramic tube: stable spraying in high temperature environment (temperature resistance >850℃)
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller,Other
Year Established:
2003
Total Annual:
8000000-10000000
Employee Number:
150~180
Ecer Certification:
Verified Supplier
Zhuzhou Sanxin Cemented Carbide Manufacturing Co.,Ltd is located in Zhuzhou, Hunan Province, which is known as the “Hometown of Cemented Carbide”. It is a national high-tech enterprise that has passed ISO9001:2015 international quality certification system, specializing in manufacturing,... Zhuzhou Sanxin Cemented Carbide Manufacturing Co.,Ltd is located in Zhuzhou, Hunan Province, which is known as the “Hometown of Cemented Carbide”. It is a national high-tech enterprise that has passed ISO9001:2015 international quality certification system, specializing in manufacturing,...
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