Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).
Sequential Cleaning Stages:
Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.
Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).
UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.
Process Parameters:
Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)
Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.
Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.
Fab Integration Advantages:
Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention
Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance
Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers
Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.
Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t... Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t...