Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
This high-performance cleaning system is specifically designed for semiconductor silicon wafer processing, integrating multi-stage ultrasonic technologies to achieve the ultra-high surface purity required for advanced microelectronics manufacturing, directly influencing device yield and reliability.
Comprehensive Cleaning Process:
Ultrasonic Alkaline Cleaning: Utilizes 40KHz-80KHz ultrasonic energy in an alkaline solution to effectively remove organic contaminants, photoresist residues, and larger particulate matter from silicon wafer surfaces and intricate structures. The ultrasonic cavitation effect ensures thorough cleaning even in narrow gaps and patterned areas, preparing the wafers for subsequent acid cleaning.
Ultrasonic Acid Cleaning: Employs the same adjustable frequency range in an acidic medium to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in the wafer's texture, leveraging the precise ultrasonic energy to avoid damaging the wafer surface.
Pure Water Rinsing: The final stage uses high-purity water with resistivity ≥18.2MΩ·cm to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from any chemical residues. This step is crucial for maintaining the wafer's surface integrity and meeting the strict purity standards required for subsequent processes like thin-film deposition and lithography.
Key Technical Parameters:
Ultrasonic Frequency: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, allowing for optimal cavitation intensity and cleaning efficiency.
Operating Temperature: 60℃, a precisely controlled temperature that enhances the reactivity of the cleaning solutions while ensuring the silicon wafers remain structurally stable, preventing any potential thermal damage.
Material Construction: Critical components in contact with the wafers and cleaning fluids are made from corrosion-resistant materials such as PFA and high-purity quartz, effectively avoiding secondary contamination and ensuring long-term stable operation of the equipment.
Outstanding Advantages:
Delivers exceptional particle removal efficiency, capable of eliminating particles as small as 0.1μm, meeting the stringent requirements of semiconductor industry standards (SEMI) for advanced node manufacturing.
The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete and synergistic cleaning cycle, ensuring comprehensive removal of various contaminants from the wafer surface.
The adjustable frequency range (40KHz-80KHz) and stable 60℃ operating temperature allow for flexible customization according to specific wafer cleaning needs, making it suitable for a wide range of silicon wafer types and processing requirements.
Designed for seamless integration into semiconductor production lines, compatible with automated wafer handling systems to streamline the manufacturing process and reduce manual intervention, improving overall production efficiency.
Application Scope: Ideal for cleaning silicon wafers in 4-inch to 12-inch semiconductor manufacturing processes, including pre-diffusion, pre-lithography, post-etching, and pre-metallization stages, widely used in both research and development laboratories and large-scale production facilities.
Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, surface treatment, microelectronics manufacturing
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
4,397,596.73-6,397,596.73
Employee Number:
460~500
Ecer Certification：
Verified Supplier
Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t... Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t...
