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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Loading IC Parts Pick Up Structure Waffle Pack With Tweezers
China Loading IC Parts Pick Up Structure Waffle Pack With Tweezers

  1. China Loading IC Parts Pick Up Structure Waffle Pack With Tweezers
  2. China Loading IC Parts Pick Up Structure Waffle Pack With Tweezers
  3. China Loading IC Parts Pick Up Structure Waffle Pack With Tweezers

Loading IC Parts Pick Up Structure Waffle Pack With Tweezers

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material PC
Color Black
Matrix QTY 12*17=204PCS
Design Non-standard
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN21105
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material PC Color Black
Matrix QTY 12*17=204PCS Design Non-standard
Surface Resistance 1.0x10E4~1.0x10E11Ω Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method Injection Moulding
Brand Name Hiner-pack Model Number HN21105
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light 204PCS Waffle PackLoading IC Parts Waffle PackWaffle Pack Chip Trays With Tweezers

Designed For Loading IC Parts With Tweezers Pick Up Structure Waffle Pack

 

The Waffle pack is used in many applications, including packaging of chips, CHIP-mount preforms, and electronic components. As component sizes continue to shrink, waffle pack is becoming a more desirable way of packaging. It is usually a plastic tray with pockets sized to fit a particular chip size.

 

Compared to the ordinary plastic bundle packaging,waffle pack can better protect the products that customers need to package. It is ideal for specific instruments in the semiconductor industry and the electronic medical industry. The 12*17 matrix can also hold more electronic chips. Our company has nearly ten years of experience in waffle pack production, We can provide customized services according to customers' needs.

 

Details About The HN21105 Matrix 12*17 Black Waffle Pack

 

The 4 inch Waffle Pack is an ideal tray for storing electronic components. In the process of use, PC material makes the product has good mechanical strength and heat resistance. At the same time, it also has good impact strength and chemical corrosion resistance and can be very good in various environments to protect customer products.

 

Hiner-pack has a professional technical team that can select the right waffle pack for your product. The 12*17 matrix can hold more products for you. This design can not only better reduce the cost of transportation and storage, but also better protect the product.

Outline Line Size 101.6*101.6*4.5mm Brand Hiner-pack
Model HN21105 Package Type Die
Cavity Size 3.1*4.9*0.9 Matrix QTY 12*17=204PCS
Material PC Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Product Application Of Waffle Pack

 

Electronic component          Semiconductor

Embedded System              Display Technology

 

Reference to temperature resistance of different materials

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Service Of IC Tray Manufacturer

 

1. We offer ESD total Solution to Customer, Many other related product available if needed.

2. OEM is welcomed or design as customer request.

3. The best & professional sale services.

4. Honest but competitive price and Quality assured quotation.

5. 100% QC inspection before shipment.

FAQ

 

Q1. Why Choose us?
1.Hiner-pack insist strict QC during producing, product performance are ensured.
Strong technical team-quick to solve problems, creative to design new items, latest RFID items.
2.Big capacity-cost-effective and flexible to adjust production for volume and urgent orders.
3.10-year factory experienced in all crafts, and with strong customization capacity, satisfy your requirement to the best.
4.Having long-term and stable material suppliers, sources are trust-able and time-effective.
5.Owning professional agents of shipping. Goods reach to you fast, save and cost-effective.

Q2. Can I order if quantity less than MOQ?
Yes and it would be taken as sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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