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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding
China Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding

  1. China Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding
  2. China Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding
  3. China Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding

Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS Injection Moulding

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material PC
Color Black
Matrix QTY 10*15=150PCS
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN21120
Certification ISO 9001 ROHS SGS
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material PC Color Black
Matrix QTY 10*15=150PCS Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding Brand Name Hiner-pack
Model Number HN21120 Certification ISO 9001 ROHS SGS
Place of Origin CHINA
High Light 4 Inch Waffle PackIC Chip Waffle Pack150PCS Waffle Pack Chip Trays

Black 4 Inch Plastic Waffle Pack For IC Chip 150PCS

The IC Chip tray is a carrier used by semiconductor chip enterprises for packaging and baking test of their chips. Compared with other traditional packaging methods, it can not only place very small components or parts, but also can improve the actual use of the product matched with accessories lid and clamps.

From the design drawings, mold manufacturing, product manufacturing to cleaning and packaging and so on. All steps and operations are under strict quality control, we take customer satisfaction products as the ultimate goal.Constantly meet customer requirements to promote our factory to a higher level of progress.

 

Details of the HN21120 Waffle Pack

This HN21120 waffle pack is made of PC. It is light in weight and strong in texture, which can effectively protect customers products. At the same time,10*15 matrix design can accommodate more customers' products. It can meet customers' different requirements for sample and mass production loading separately.

 

The production not only requires high requirements in the process of transportation and transfer, but also needs to deal with the turning over of automation equipment. Our company has accumulated a lot of experience in the production of this kind of products, which can fully meet the diversified needs of customers and provide design, production integrated packaging scheme.

Outline Line Size 101.57*101.57*5.5mm Brand Hiner-pack
Model HN21120 Package Type Die
Cavity Size 2.9*6*1.29 Matrix QTY 10*15=150PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Service of the HN21120 Chip Tray

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.

 

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans:Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Ans:Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
Ans:We can send you them right now if you are interested in something we have stock.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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