Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Matrix QTY | 5*6=30PCS |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN21134 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Matrix QTY | 5*6=30PCS | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding | Brand Name | Hiner-pack |
| Model Number | HN21134 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA | ||
| High Light | SGS Waffle Pack Trays ，Optoelectronic Chips Waffle Pack Trays ，30PCS Waffle Pack Chip Trays | ||
Standard SGS ROHS Compliant Waffle Pack For Optoelectronic Chips
Hiner-pack has the professional technical teams, leading mold processing and the most advanced injection molding equipment. High level clean cleaning equipment and a variety of testing equipment for your products to provide the best quality service. At the same time, we has established deep cooperation with many well-known enterprises in the world, and built a research and development base of polymer materials with well-known universities and research institutions in China.
Master special technology and manufacturing in the field of semiconductor packaging raw materials.Through years of efforts, our company constantly improve semiconductor packaging products, introduce new products and solve customers' needs for high-quality products.
Details of HN21134 Waffle Pack
HN21134 waffle pack is usually used to carry smaller chips, while the 5 x 6 matrix design which not only realizes easy transportation, but also can carry a large number of chips. The product is mainly made of PC material, which has excellent electrical insulation, elongation,dimensional stability and chemical corrosion resistance.This makes it self-extinguishing, flame retardant, non-toxic pollution and other advantages to ensure product safety.
In order to avoid products jumping out of waffle pack pockets during shipping, we can also provide matching lids, clamps, and other appropriate accessories. High quality and complete service packaging ensures the transfer, transportation and storage of customers' products to avoid risks to the greatest extent.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21134 | Package Type | Die |
| Cavity Size | 4.8*6.0*0.6 | Matrix QTY | 5*6=30PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN21134 Chip Tray
Semiconductor Electronic Component Factories
SMT Surfacing Factories Optical Industry
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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