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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry
China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

  1. China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry
  2. China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry
  3. China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry
  4. China Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS
Color Black
Property ESD
Design Standard
Size 2 Inch
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days, Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN2079
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material ABS Color Black
Property ESD Design Standard
Size 2 Inch Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days, Mold Life Span: 30~450,000 Times Molding Method Injection Moulding
Brand Name Hiner-pack Model Number HN2079
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light Wafer Tray Packaging ElectronicsESD Wafer Bare Die TrayCSP Tray Packaging Electronics

Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).


An anti-static tray is an ideal tool for storing electronic components. Due to the addition of special polymer chains in the raw material, the finished product has permanent electrostatic dissipation properties. The finished product has good mechanical strength and heat resistance. Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time, and temperature.


Hiner-pack production Waffle Pack (IC tray) is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.

Advantage:

1. More than 12 years of export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized

Service:

1. We have sample stock, which can also help the client to choose which type is suitable for them.
2. We will reply to you at any time if you have questions.
3. Choose a suitable product for clients according to the clients' requirements.
4. After mold customization, free samples will be provided until the customer tests OK, to remove the quality concerns of customers before production.

Technical Parameters:

Brand Hiner-pack Outline Line Size 50.7*50.7*4mm
Model HN2079 Cavity Size 0.7*1.2*0.25mm
Package Type IC Parts Matrix QTY 10*10=100PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS/SGS

waffle pack ic chip tray HN2079-1

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.

waffle pack ic chip tray HN2079-2

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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