Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Size | 2-inch |
| Molding Method | Injection Moulding |
| Injection Mold | Lead Time 20~25 Days |
| Color | Black, Red, Yellow, Green, White...etc. |
| Clean Class | General And Ultrasonic Cleaning |
| Design | Stackable |
| Warpage | ＜0.2mm |
| Brand Name | Hiner-pack |
| Model Number | HN24007 |
| Certification | ISO9001, ROHS, SGS |
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Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Size | 2-inch |
| Molding Method | Injection Moulding | Injection Mold | Lead Time 20~25 Days |
| Color | Black, Red, Yellow, Green, White...etc. | Clean Class | General And Ultrasonic Cleaning |
| Design | Stackable | Warpage | ＜0.2mm |
| Brand Name | Hiner-pack | Model Number | HN24007 |
| Certification | ISO9001, ROHS, SGS | ||
| High Light | 2-inch Bare Die Tray ，Ultrasonic Cleaning Bare Die Tray ，High Temperature Resistance Bare Die Tray | ||
Injection Mold Bare Die Tray With High Temperature Resistance
Bare Die Trays, also known as waffle pack trays, are thin trays typically measuring 2 inches or 4 inches square. These trays feature a regular pattern of separator ribs that create pockets, giving them the appearance of a waffle.
Waffle pack chip trays are mainly used for handling and transporting bare die or chip scale packages (CSP). These trays are equipped with simple rectangular pockets. Custom waffle pack trays are favored in scenarios where processes already adhere to the waffle pack format but require special properties, such as bakeable material or unique pocket geometry.
1. These trays are meticulously designed to ensure that the materials utilized effectively absorb all electrostatic discharge (ESD) produced during the handling and transporting of dies.
2. The trays are engineered to be compatible with a wide temperature range, allowing for easy handling of the dies during transitions between processes. This ensures that the dies are maintained within the optimal temperature range.
3. The die trays are certified for use in a completely contaminant-free clean room environment. They are specially designed to absorb any electrical shocks that could potentially damage the dies.
4. These trays come in various sizes to accommodate different die dimensions, and are versatile enough to support all types of dies based on user preference.
| HN24007 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 7*12=84PCS | 5.00*2.141*2.157mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
The die tray is primarily utilized in the manufacturing and assembly processes of semiconductor dies. These trays play a crucial role as a common interface for efficiently moving dies between different production centers in semiconductor companies.
In addition to transportation, die trays also function as a reliable method for securing the dies during testing procedures and while in storage.
You can find the die tray in various semiconductor research institutions, as well as in stores and production facilities across the industry.
The main application of these trays lies in facilitating the transportation and testing of prototype semiconductor dies.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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