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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Durable 2-inch Chip Tray With ESD Protection For Microelectronics
China Durable 2-inch Chip Tray With ESD Protection For Microelectronics

  1. China Durable 2-inch Chip Tray With ESD Protection For Microelectronics
  2. China Durable 2-inch Chip Tray With ESD Protection For Microelectronics
  3. China Durable 2-inch Chip Tray With ESD Protection For Microelectronics
  4. China Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Durable 2-inch Chip Tray With ESD Protection For Microelectronics

  1. MOQ: 1000 Pcs
  2. Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Place Of Origin Shenzhen, China
Packaging Details It Depends On The QTY Of Order And Size Of Product
Delivery Time 5~8 Working Days
Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per Day
Use Transport, Storage, Packing
Incoterms EXW, FOB, CIF, DDU, DDP
Color Black, Red, Yellow, Green, White...etc.
Durability Sturdy And Impact-Resistant
Customized Service Support Standard And Non-standard, Precision Machining
Warpage <0.2mm
Temperature 80°C~180°C
Brand Name Hiner-pack
Model Number HN24022
Certification ISO9001, ROHS, SGS

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  1. Product Details
  2. Company Details

Product Specification

Place Of Origin Shenzhen, China Packaging Details It Depends On The QTY Of Order And Size Of Product
Delivery Time 5~8 Working Days Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per Day Use Transport, Storage, Packing
Incoterms EXW, FOB, CIF, DDU, DDP Color Black, Red, Yellow, Green, White...etc.
Durability Sturdy And Impact-Resistant Customized Service Support Standard And Non-standard, Precision Machining
Warpage <0.2mm Temperature 80°C~180°C
Brand Name Hiner-pack Model Number HN24022
Certification ISO9001, ROHS, SGS
High Light Microelectronics Chip TrayDurable Chip TrayESD Protection Chip Tray

Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Waffle packs, also known as waffle pack trays, are typically thin trays measuring 2” or 4” square. They feature a regular pattern of separator ribs that give them the appearance of a waffle.

These waffle pack chip trays are commonly employed for managing and transporting bare die or chip scale packages (CSP). They usually come with straightforward rectangular pockets. For scenarios where specific requirements are essential, such as the need for bakeable material or unique pocket geometry, custom waffle pack trays are favored.

Features:

These products are specifically designed with the consideration that the materials utilized can absorb all electrostatic discharge (ESD) generated during the handling and transportation of dies.

The temperature versatility of these items allows for easy handling of dies as they move between different processes. This feature ensures that the dies are maintained within the ideal temperature range for their placement.

The die trays are officially certified for use in a clean room environment that is completely free from contaminants. This is due to their ability to neutralize the electric shock that can potentially damage the dies during handling.

These trays come in various sizes suitable for all types of dies, and they are universally compatible with different die varieties, catering to the preferences of the user.

Technical Parameters:

HN24022 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 8*10=80PCS 4.45*3.15*0.83mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D

Applications:

The die tray plays a crucial role in the production and assembly of semiconductor dies. Specifically, it serves as a common bridge for semiconductor companies to facilitate the transportation of dies between different production centers.

Besides its transportation function, die trays are also utilized as a means of securing the dies during testing and for storage purposes.

Die trays are readily available in most semiconductor research associations, stores, and production units. They are essential tools primarily used for handling and testing prototype semiconductor dies.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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