Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Size | 2-inch |
| Warpage | ＜0.2mm |
| Temperature | 80°C~180°C |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Color | Black, Red, Yellow, Green, White...etc. |
| Material | ABS, PC, PPE, MPPO...etc. |
| Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack |
| Model Number | HN24024 |
| Certification | ISO9001, ROHS, SGS |
View Detail Information
Explore similar products
2-inch Injection Mold Bare Die Tray With High Temperature Resistance For Clean
Square Regular Antistatic IC Chip Transfer Tray Environmental Friendly
Chip Scale Packages IC Die Carriers For Precise Die Placement And Stackable
Precision Machining Bare Die Trays For Transport And Customized Service By
Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Size | 2-inch |
| Warpage | ＜0.2mm | Temperature | 80°C~180°C |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω | Color | Black, Red, Yellow, Green, White...etc. |
| Material | ABS, PC, PPE, MPPO...etc. | Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack | Model Number | HN24024 |
| Certification | ISO9001, ROHS, SGS | ||
| High Light | Semiconductor Facilities Bare Die Tray ，Tray for Bare Die Storage ，Compact Bare Die Storage Tray | ||
Compact Grid Tray for Bare Die Storage in Semiconductor Facilities
Bare Die Trays Overview
Bare Die Trays, also known as waffle pack trays, are slim trays typically measuring 2” or 4” square. These trays feature a uniform arrangement of separator ribs, creating distinct pockets that give them the appearance of a waffle.
Utilization of Waffle Pack Chip Trays
Waffle pack chip trays serve as essential tools for managing and transporting bare dies or chip scale packages (CSP). These trays commonly come equipped with uncomplicated rectangular pockets. In instances where specific requirements such as bakeable materials or customized pocket geometry are essential, customized waffle pack trays are widely favored.
1. ESD Protection: These die trays are meticulously designed to ensure that the materials utilized have the capability to absorb all electrostatic discharge (ESD) generated during the handling and transportation of dies.
2. Temperature Friendly: The die trays are suitable for a wide temperature range, allowing for easy handling of dies as they transition between different processes. This feature guarantees the optimal temperature environment for the placement of the dies.
3. Clean Room Certified: The die trays are certified for clean room usage, ensuring a 100% contaminant-free environment. This certification is vital as the trays effectively mitigate electric shocks that could potentially damage the dies.
4. Versatile Compatibility: These trays come in various die sizes and are engineered to be compatible with all types of dies, catering to the preferences and requirements of users.
| HN24024 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 16*16=256PCS | 1.65*1.65*0.8mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
The die tray plays a crucial role in semiconductor manufacturing and assembly. It serves as a primary tool for transporting semiconductor dies between production centers within the industry. Furthermore, die trays are essential for securely holding the dies during testing procedures and for safe storage purposes.
In addition to its transportation and storage functions, die trays are also employed as a protective measure for delicate semiconductor dies during testing phases. Their availability in various semiconductor research organizations, as well as stores and production facilities, ensures easy access and utilization within the industry.
Die trays are primarily designed and used for the efficient transportation and testing of prototype semiconductor dies, reflecting their significant role in the development and production of semiconductor technologies.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!