Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Size | 2-inch (4-inch Optional) |
| Property | ESD Or Non-ESD |
| Lid And Clip | Optional |
| Injection Mold | Lead Time 20~25 Days |
| Material | ABS, PC, PPE, MPPO, PEI, HIPS...etc. |
| Use | Transport, Storage, Packing |
| Clean Class | General And Ultrasonic Cleaning |
| Brand Name | Hiner-pack |
| Model Number | HN24034 |
| Certification | ISO 9001 ROHS SGS |
View Detail Information
Explore similar products
2-inch Injection Mold Bare Die Tray With High Temperature Resistance For Clean
Square Regular Antistatic IC Chip Transfer Tray Environmental Friendly
Chip Scale Packages IC Die Carriers For Precise Die Placement And Stackable
Precision Machining Bare Die Trays For Transport And Customized Service By
Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Size | 2-inch (4-inch Optional) |
| Property | ESD Or Non-ESD | Lid And Clip | Optional |
| Injection Mold | Lead Time 20~25 Days | Material | ABS, PC, PPE, MPPO, PEI, HIPS...etc. |
| Use | Transport, Storage, Packing | Clean Class | General And Ultrasonic Cleaning |
| Brand Name | Hiner-pack | Model Number | HN24034 |
| Certification | ISO 9001 ROHS SGS | ||
| High Light | Multiple Bare Die Chip Holders ，Dust-Free Bare Die Chip Holders ，Safety Bare Die Chip Holders | ||
Multiple Bare Dies Capacity Chip Holders For Dust-Free Die Storage And Safety
The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack offers a safe and convenient solution for packaging and transporting various microelectronic components such as Chips, Dies, COGs, and Optoelectronic devices. These products come in different sizes and materials to meet diverse needs. The product specifications include options for 2-inch and 4-inch sizes, while materials range from Antistatic and Conductive ABS to PC. Customization is also available to cater to the specific requirements of customers.
Molded of ESD-safe Materials: Our products are made of ESD-safe, non-sloughing, and carbon-powder-free clean polymers to ensure the safety of your electronics equipment.
Carbon-Fiber Reinforced Design: To provide both strength and permanent ESD protection, our products are carbon-fiber reinforced, giving you added durability and peace of mind.
High Temperature Resistance: With an available bake temperature of up to 180°C, our products can withstand high-temperature environments, making them versatile for various applications.
Customized Industry-Standard Formats: Our products come in industry-standard formats that can also be customized to meet your specific needs, ensuring a tailored solution for your requirements.
| HN24034 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 10*5=50PCS | 8.00*3.20*1.35mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
The external dimensions of waffle pack chip trays are standardized into different sizes: 2-inch, 4-inch, and so on, where each size corresponds to a square shape. The variability lies in the size of the pockets, their geometry, and the number of pockets present in the tray.
When it comes to waffle pack trays, they are typically described by several key characteristics:
For custom waffle pack trays, additional specifications are necessary:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!