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{"title":"Injection Moulding Bare Die Trays With Anti-Static ABS And High Clean Class","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/33\/b5\/4e021d7e15e614eff92577b52640-200x200-1\/injection_moulding_bare_die_trays_with_anti_static_abs_and_high_clean_class.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24087","Certification":"ISO 9001 ROHS SGS","Minimum Order Quantity":"1000 Pcs"}}
{"title":"2-inch Injection Mold Bare Die Tray With High Temperature Resistance For Clean","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/d1\/0b\/17b92c2b2f65016cf97c82697277-200x200-1\/2_inch_injection_mold_bare_die_tray_with_high_temperature_resistance_for_clean_class_general_and_ultrasonic_cleaning.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24007","Place Of Origin":"Shenzhen, China","Certification":"ISO9001, ROHS, SGS"}}
{"title":"Square Regular Antistatic IC Chip Transfer Tray Environmental Friendly","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/52\/be\/6ad42bd617b1456794212973af72-200x200-1\/square_regular_antistatic_ic_chip_transfer_tray_environmental_friendly.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"3 Inch Series","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Chip Scale Packages IC Die Carriers For Precise Die Placement And Stackable","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/f0\/26\/d974c9366b88362e1a98bb660831-200x200-1\/chip_scale_packages_ic_die_carriers_for_precise_die_placement_and_stackable.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24008","Place Of Origin":"Shenzhen, China","Certification":"ISO 9001 ROHS SGS"}}
{"title":"Precision Machining Bare Die Trays For Transport And Customized Service By","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/0a\/0c\/d094b033c31ad593565eca27ed64-200x200-1\/precision_machining_bare_die_trays_for_transport_and_customized_service_by_injection_moulding.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24009","Place Of Origin":"Shenzhen, China","Certification":"ISO 9001 ROHS SGS"}}
{"title":"Durable 2-inch Chip Tray With ESD Protection For Microelectronics","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/0e\/9d\/0b81f6680097d57b7fc84cfad511-200x200-1\/durable_2_inch_chip_tray_with_esd_protection_for_microelectronics.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN24022","Place Of Origin":"Shenzhen, China","Certification":"ISO9001, ROHS, SGS"}}
{"title":"3 Inch Waffle Pack Bare Die Trays 44PCS Environment Friendly","imgUrl":"https:\/\/img.silkroadsl.com\/nimg\/85\/11\/a534a3a9b893f835ea9e5a4dafb2-200x200-1\/3_inch_waffle_pack_bare_die_trays_44pcs_environment_friendly.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN20105","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Chinese mainland"}}
The Bare Die Tray series from Hiner-pack provides a safe and convenient way of packaging and transportation for Chip, Die, COG, Optoelectronic devices, and other microelectronic components. Products with multiple sizes and different materials are available, product specifications are 2 inches, 3 inches, and 4 inches. Materials have Antistatic / Conductive ABS and PC. They can also be customized according to the customer's special requirements.
We have a variety of sizes and styles of Bare Die Tray molds. These molds have high requirements for product size and flatness. Hiner-pack utilizes Moldflow analysis in the product mold design process to accurately control the product size precision and plane degree. This control is done in accordance with the material characteristics, mold structure, and injection molding conditions to meet the quality requirements of customers.
Features:
Permanent Antistatic: Compliant with ESD and RoHS environmental standards. Our products are designed to be environmentally friendly and long-lasting.
Collaboration with automation processes enhances product yield and boosts production efficiency. This partnership ensures optimal performance and consistency in manufacturing operations.
Ensuring stable size and high precision, our products are equipped to withstand transportation without being easily crushed. This reliability contributes to overall product quality and customer satisfaction.
Following product formation, each item undergoes dust-free cleaning and is meticulously packaged. This process ensures a high level of cleanliness, making the products suitable for class 10-1000 cleanroom environments.
Customization is a key aspect of our service, with design styles and sizes tailored to meet each customer's specific requirements. We aim to deliver personalized solutions that align with individual preferences and needs.
Technical Parameter:
HN24087 Technical Data Ref.
Base Information
Material
Color
Matrix QTY
Pocket Size
ABS
Black
16*26=416PCS
3.6*1.4*1.1mm
Size
Length * Width * Height (according to customer's requirement)
Feature
Durable;Reusable;Rcofriendly;Biodegradable
Sample
A. The free samples: Choosen from existing products.
B.Customized samples as per your design/demand
Accessory
Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format
PDF,2D,3D
Support and Services:
We specialize in designing and manufacturing custom trays to meet the strict quality standards of the microelectronic and various other industries. With our efficient processes, we can create and deliver customized trays within just two weeks. Our range of trays are utilized in diverse industries for protecting, automating, storing, and shipping a wide array of products.
The utility of our bespoke packaging trays is not limited to the semiconductor sector. These trays find applications in any industry that deals with managing small item inventories, including medical supplies, gemstones, springs, screws, watch components, and more. Our device trays are engineered to seamlessly integrate with both manual and automated tool handling systems, ensuring reliable performance and optimal protection of devices, all while reducing shipping and storage costs.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...