Shenzhen Hiner Technology Co.,LTD
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Molding Method | Injection Moulding |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning |
| Anti-Static | Yes |
| Injection Mold | Lead Time 20~25 Days |
| Humidity Resistance | Up To 90% RH |
| Design | Standard And Non-standard |
| Use | Transport, Storage, Packing |
| Brand Name | Hiner-pack |
| Model Number | HN24072 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CN |
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Product Specification
| Packaging Details | It Depends On The QTY Of Order And Size Of Product | Delivery Time | 5~8 Working Days |
| Payment Terms | T/T | Supply Ability | 4000PCS~5000PCS/per Day |
| Molding Method | Injection Moulding | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Clean Class | General And Ultrasonic Cleaning | Anti-Static | Yes |
| Injection Mold | Lead Time 20~25 Days | Humidity Resistance | Up To 90% RH |
| Design | Standard And Non-standard | Use | Transport, Storage, Packing |
| Brand Name | Hiner-pack | Model Number | HN24072 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | SHENZHEN CN |
| High Light | Chip Storage Bare Die Tray ，0.3mm Bare Die Tray ，Packing Bare Die Tray | ||
The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. The products come in multiple sizes and materials, including 2 inches, 3 inches, and 4 inches. The materials available are Antistatic/Conductive ABS and PC, and can be customized to meet specific customer requirements.
At Hiner-pack, we provide a variety of sizes and styles of molds for Chip Tray & Waffle Pack, with high demands for product size and flatness. Our process begins with the imported Moldflow analysis for product mold design, allowing us to accurately control product size precision and flatness based on material properties, mold structure, and injection molding conditions. This ensures that we meet the quality standards set by our customers.
| HN24072 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 19*26=494PCS | 2.6*1.22*0.8mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable;Reusable;Rcofriendly;Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
We have the capability to create custom trays from scratch and deliver them within just three weeks, meeting the strict quality standards of microelectronic and various other industries. These trays play a crucial role in safeguarding, automating, storing, and shipping a diverse range of products.
The utility of our custom packaging trays goes well beyond the realm of the semiconductor industry. They find applications in situations where managing an inventory of small items is essential, such as in the medical field for parts, gems, springs, screws, watch components, and more. These device trays are specifically crafted to work seamlessly with manual or automated tool handling systems, ensuring reliable performance and high-level protection for devices, all while reducing shipping and storage expenses.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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